2-Layer RF-10 PCB 0.3mm Thin Immersion Gold Finish for High-Frequency RF Applications
1.Introduction
RF-10 copper clad laminates are composites of ceramic-filled PTFE and woven fiberglass, engineered to deliver superior performance in high-frequency RF applications. These laminates excel in size reduction for RF circuits while maintaining low dielectric loss and excellent dimensional stability. The smooth, low-profile copper bonding ensures minimal insertion losses, especially critical at higher frequencies where skin effect losses dominate. RF-10 is a cost-effective substrate with industry-leading delivery times, making it a preferred choice for demanding RF and microwave designs.
2.Key Features
Dielectric Constant: 10.2 ± 0.3 at 10GHz, enabling compact circuit designs.
Low Dissipation Factor: 0.0025 at 10GHz for minimal signal loss.
Thermal Conductivity: 0.85 W/mk (unclad) for effective heat dissipation.
CTE Stability: Low expansion rates (x: 16 ppm/°C, y: 20 ppm/°C, z: 25 ppm/°C).
Moisture Resistance: 0.08% absorption for reliable performance in humid environments.
Flame Retardant: V-0 rating for enhanced safety.
3.Benefits
Size Reduction: High DK allows for smaller RF circuit designs.
Dimensional Stability: Tight tolerances and low CTE ensure consistent performance.
Thermal Management: High thermal conductivity prevents overheating.
Smooth Copper Adhesion: Ensures optimal signal integrity and low insertion loss.
Cost-Effective: Superior performance at a competitive price.
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RF-10 (ceramic-filled PTFE) |
| Layer Count | 2 (Double Layer) |
| Board Dimensions | 45mm × 50mm (±0.15mm) |
| Min. Trace/Space | 6/5 mils |
| Min. Hole Size | 0.3mm |
| Via Type | Through-hole only (No Blind Vias) |
| Finished Thickness | 0.3mm |
| Copper Weight | 1oz (35μm) |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold |
| Silkscreen (Top/Bottom) | No / No |
| Solder Mask (Top/Bottom) | No / No |
| Electrical Test | 100% tested pre-shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 - 35μm (1oz)
RF-10 Core - 10mil (0.254mm)
Copper layer 2 - 35μm (1oz)
6.PCB Statistics:
Components: 7
Total Pads: 29
Thru Hole Pads: 21
Top SMT Pads: 8
Bottom SMT Pads: 0
Vias: 14
Nets: 2
7.Typical Applications
Microstrip Patch Antennas
GPS Antennas
Passive Components (filters, couplers, power dividers)
Aircraft Collision Avoidance Systems
Satellite Components
8.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support